中文操作手册CN1.0
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1
LED LED的正确使用方法的正确使用方法
C-E (HONG KONG) LTD.
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.2
責任聲明
對於任何因使用或不當使用本手冊而引致或所涉及的任何損失、毀壞或損害（包括但不限於相應而生的損失、損毀或損害），
西鐵城電子有限公司概不承擔任何法律責任、義務或責任
本手冊內的資訊均以「現況」形式提供,
對其完整性、準確性、合法性、
因本手冊內的資訊或利用本手冊內的資訊而對使用者或第三者的權益造成損害西鐵城電子有限公司概不作任何明示或默示的保證
西鐵城電子有限公司保留權利、在毋須給予任何理由或事先通知的情況下隨時刪除或編輯本手冊內的一切資料
This is an uncontrolled drawing provided for reference purposes only.
Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
①LED的保管注意
?避免雨水和阳光的直射、请在阴暗处保管。
请避免高温(100C以上)，高湿(60%RH以上)。?避免露水。?避免灰尘。
?避免碰到液体和油。?避免腐蚀性气体。
Cl2,H2S,NH3,SOx,NOx 。?避免海水和海风。
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
②LED的运输注意
未用于生产的产品应该放在托盘和纸箱内保管、
避免跌落等衝撃。
导线连接后避免重叠排列、导致划伤发光面。
This is an uncontrolled drawing provided for reference purposes only.
Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
③LED的组装注意
绝对不能触碰发光面（包括白色树脂部分）避
免挤压、摩擦、碰撞。
擦伤
断线
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
④为何ＣｏＢ不能回流焊？
外层和铝材料层有脱落的可能性。
外层和铝是用粘着剤来固定的。回流焊接会使
粘着剤溶化导致外层脱落。
外层铝
粘着剤
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
⑤LED的发光面污秽
Grease和油、粘着剤等注意请不要接触到発光
面。
污垢用气枪能去除。条件：
气枪的压力：0.5MPa 时间：1～2秒
距离：隔开20cm以上
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
①焊锡的选择
焊锡棒的前端大小
请不要使用太细的
焊锡棒。
PWB
端子
PWB
前端
太细的焊锡棒
Good !
No Good…
粗大的焊锡棒
太细
粗大
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
①焊锡时的注意事項
焊锡棒的前端温度在350度以下。
焊接在3.5秒以內要转移焊接点。
焊接温度太高会使基板脱落。
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
②导热胶的涂法
导热胶用量不足会发生起泡导致放热性能低。
气泡的产生可以用X射线確認。全面涂全三点涂法一点涂法
另外可以确认测量Tc温度的影响。
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
③現在普及的导热胶涂法
涂胶器的定量涂法
根据涂面大小来涂抹
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
①产生静電情况
COB 用HBM 1000V以上会产生。
JEITA ED-4701/304
LED实际作业时请
使用静电环。
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
②静電和電流过大所引发的問題
電流过大导致二级管焼坏。
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
①什么东西会使LED引起硫化？
CoB是使用铝的成分，本身没有硫化的問題。
SMD是有銀的成分、H2S的环境下会引发硫化。Ｓ（硫黄）有很多品种。?大气层中（H2S、SOx）?Flux（焊锡）
?潤滑油（拧螺丝时用的油）
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
②LED一旦硫化后。。。
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1. H2S gas testing
Conditions;H2S 10ppm
Tamb = 25 C
2. THB
(Thermal Humidity Bias Test)
Conditions;85C , 85%RH
If = rated current
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Citizen Electronics Co.,LTD. reserves the right to implement engineering changes and to modify dimensions, design details, and materials as necessary.
16
５）LED LED的封的封的封装装
構造
organic
substrate
Reflector LED die
Gold wire
Ag plating
SMD
Printed circuit board type
Encapsulant
(Silicone+Phosphor)
Au plating
organic substrate
Dum LED die
Gold wire
Die attach CoB
Chip on Aluminum type
Encapsulant
(Silicone+Phosphor)
Aluminum